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As semiconductor devices become increasingly complex and miniaturized, advanced packaging solutions like Chip on Submount (CoS) bonding and testing are gaining critical importance. CoS technology involves mounting semiconductor chips directly onto a submount substrate, enhancing electrical performance, thermal management, and overall device reliability. This technique is widely used in high-frequency and optoelectronic applications, including 5G communications, automotive sensors, and LED lighting.

CoS bonding ensures precise alignment and secure attachment of chips, enabling efficient signal transmission and heat dissipation. Complementing this, rigorous testing solutions verify the integrity and functionality of bonded assemblies, detecting defects that could affect performance or lifespan. Together, bonding and testing are integral to manufacturing high-quality semiconductor modules that meet stringent industry standards.

According to Market Research Future, the Chip on Submount bonding and testing solutions market is poised for substantial growth driven by the escalating demand for compact, high-performance semiconductor devices. Technological advancements in bonding techniques, such…

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